Thermal analysis of IGBT by isogeometric boundary element method
Published in In the proceedings of 2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020
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Recommended citation: Yubo Guo, Huiping Yu, Yanpeng Gong, Fei Qin, "Thermal analysis of IGBT by isogeometric boundary element method." In the proceedings of 2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020.