Biography

北京工业大学力学系副研究员，德国洪堡学者。2019 年在北京理工大学宇航学院力学系获得博士学位，期间于 2017-2018 年获国家留学基金委支持赴英国杜伦大学工程系联合培养，2019 年加入北京工业大学。2023-2025 年受德国洪堡基金会资助赴莱布尼茨-汉诺威大学开展学术研究。

我的研究方向是计算力学，专注于为电子封装可靠性问题、软体机器人等应用发展多尺度计算方法和机器学习算法。主要从事深度学习驱动的多尺度计算力学、电子封装可靠性预测及计算力学软件开发等方向研究。感兴趣的领域包括挠曲电材料性能表征、磁控软体机器人设计以及多物理场耦合问题相关的数值模拟技术（见研究）。目前已发表 SCI 论文 50 余篇，其中在计算力学领域顶级期刊 Comput. Methods Appl. Mech. Eng.、Appl. Math. Model.、Int. J. Numer. Methods Eng.等发表多篇论文（见论文）。合作出版专著《等几何边界元法》。曾入选德国洪堡学者、北京市朝阳区“凤凰计划”优秀青年人才，现任 Scientific Reports 编委和《应用力学学报》、《电子与封装》青年编委，2025 年获得杜庆华工程计算方法优秀青年学者奖等。

每年招收力学/机械博士研究生和硕士研究生（欢迎推免生和统考生）；目前有训练性课题支持本科生参与科研活动和竞赛，欢迎邮件或前往 基础楼703讨论。

Welcome! I am Yanpeng Gong, an Associate Research Fellow at Beijing University of Technology and a Humboldt Fellow. I received my Ph.D. degree in Mechanics from the School of Aerospace Engineering, Beijing Institute of Technology in 2019, during which I was supported by the China Scholarship Council to conduct joint research at Durham University, UK from 2017 to 2018. I joined Beijing University of Technology in 2019. From 2023 to 2025, I conducted academic research at Leibniz University Hannover as a Humboldt Fellow.

My research focuses on computational mechanics, with an emphasis on developing multiscale computational methods and machine learning algorithms for electronic packaging reliability and soft robotics applications. My current research encompasses deep learning-driven multiscale computational mechanics, electronic packaging reliability prediction, and computational mechanics software development. Research interests include flexoelectric material characterization, magnetically controlled soft robot design, and numerical simulation techniques for multi-physics coupling problems (see Research).

I have published over 50 SCI papers, with multiple publications in leading computational mechanics journals including Comput. Methods Appl. Mech. Eng., Appl. Math. Model., and Int. J. Numer. Methods Eng. (see Publications). I co-authored the monograph “Isogeometric Boundary Element Method” (in Chinese).

I have been selected as a distinguished young talent in Beijing Chaoyang District’s “Phoenix Program”. I currently serve as an editorial board member for Scientific Reports (Nature Publishing Group), and as a young editorial board member for both the Chinese Journal of Applied Mechanics and Electronics & Packaging. In 2025, I received the Du Qinghua Outstanding Young Scholar Award in Engineering Computational Methods.