团队 People
课题组负责人 Principal Investigator
硕士研究生 Graduate Students
2023.09-present, 贺一达, Yida He is working on machine learning applications in multiscale structures of electronic packaging.
2023.09-present, 李思帅, Sishuai Li is working on virtual element method for thermo-mechanical coupling analysis in multiscale electronic packaging structures.
2024.09-present, 张乐通（推免生）, Letong Zhang is working on phase field modeling of thermal cycling-induced failure mechanisms in electronic packaging.
2024.09-present, 宋锦泉, Jinquan Song is working on stochastic phase field modeling of material property uncertainties in electronic packaging.
2025.09-present, 张宇喆, Yuzhe Zhang, research topic to be determined.
2025.09-present, 杨东晋, Dongjin Yang, research topic to be determined.
招生信息 Recruitment: 每年招收力学/机械博士研究生和硕士研究生（欢迎推免生和统考生），有志于计算力学、机器学习算法、电子封装可靠性研究的同学请提前联系。课题组有充足的科研训练机会和国际学术交流平台。欢迎邮件咨询！
毕业生 Alumni
硕士研究生 Graduate Students
2022.09-2025.06, 寇玉国, 毕业论文题目：热力耦合相场模型在电子封装互连结构中的应用 Application of thermal coupled phase field model in electronic packaging interconnection structures 北京工业大学优秀毕业论文. 毕业去向：华南理工大学（读博）.
2021.09-2024.06, 徐浩, 毕业论文题目：边界元法在电子封装瞬态问题中的应用 Application of boundary element method to transient problems in electronic packaging 北京工业大学优秀毕业论文. 毕业去向：北京新风航天装备有限公司.