团队 People
课题组负责人 Principal Investigator
硕士研究生 Graduate Students
2024.09-present, 张乐通（推免生）, Letong Zhang is working on phase field modeling of thermal cycling-induced failure mechanisms in electronic packaging.
2024.09-present, 宋锦泉, Jinquan Song is working on stochastic phase field modeling of material property uncertainties in electronic packaging.
2025.09-present, 张宇喆, Yuzhe Zhang is working on probabilistic fracture analysis of heterogeneous brittle materials, coupling cross-correlated random fields (Karhunen–Loève expansion) with the phase-field cohesive zone model (PF-CZM) and Monte Carlo simulation.
2025.09-present, 杨东晋, Dongjin Yang is working on machine learning-based heterogeneous parameter inversion for fracture behavior prediction and reliability analysis of brittle ceramics (e.g., aluminum nitride).
招生信息 Recruitment: 每年招收力学/机械博士研究生和硕士研究生（欢迎推免生和统考生），有志于计算力学、机器学习算法、电子封装可靠性研究的同学请提前联系。课题组有充足的科研训练机会和国际学术交流平台。欢迎邮件咨询！
毕业生 Alumni
硕士研究生 Graduate Students
2023.09-2026.06, 贺一达, 毕业论文题目：物理信息机器学习在封装多尺度结构力学分析中的应用研究 Application of physics-informed machine learning to mechanical analysis of multi-scale electronic packaging structures 北京工业大学优秀毕业论文. 毕业去向：北京华航无线电测量研究所.
2023.09-2026.06, 李思帅, 毕业论文题目：虚单元法在多尺度电子封装结构中的应用研究 Research on the application of virtual element method in multiscale electronic packaging structures 北京工业大学优秀毕业论文. 毕业去向：北京曙光航空电气有限责任公司.
2022.09-2025.06, 寇玉国, 毕业论文题目：热力耦合相场模型在电子封装互连结构中的应用 Application of thermal coupled phase field model in electronic packaging interconnection structures 北京工业大学优秀毕业论文. 毕业去向：华南理工大学（读博）.
2021.09-2024.06, 徐浩, 毕业论文题目：边界元法在电子封装瞬态问题中的应用 Application of boundary element method to transient problems in electronic packaging 北京工业大学优秀毕业论文. 毕业去向：北京新风航天装备有限公司.