Publications

Below is a chronological list of my publications in refereed journals. For recent highlights, please visit my profile at . For citation statistics, see my or profile.


    Forthcoming

  1. L. Zhang, Y. Zhang, D. Yang, Y. He, S. Li, Z. Wang, Y. Gong*. Research progress on mechanics computational methods for multi-scale electronic packaging structures (电子封装多尺度结构力学计算方法研究进展) (In Chinese). Chinese Journal of Applied Mechanics (2026) Accepted

    2. 2026

  2. Z. Wang, L. Zhang, Y. Gong*. Effect of loading configuration and edge defect on the biaxial flexural behavior of annealed and chemically strengthened aluminosilicate glass plates. Thin-Walled Structures 226 (2026) 114927
    Biaxial flexural test of glass plates
  3. Y. Gong, Y. He, Y. Mei*, X. Zhuang*, F. Qin, T. Rabczuk. Physics-informed Kolmogorov-Arnold networks for multi-material elasticity problems in electronic packaging. Applied Mathematical Modelling 156 (2026) 116793 [arXiv] [Code]
    PIKAN flowchart
  4. Y. Gong, S. Li, Y. Mei*,B. Xu, F. Qin, X. Zhuang, T. Rabczuk. A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures. Engineering Analysis with Boundary Elements 184 (2026) 106640. [arXiv] [Code]
    VE-FE Coupling mesh

    5. 2025

  5. Y. Gong*, S. Li, F. Qin, B. Xu*. Virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features. Engineering with Computers 41 (2025) 4799–4824 [arXiv] [Code]
    Mesh used in Virtual Element Method
  6. X. Zhuang*, H. Hu**, S. S. Nanthakumar, Q.-T. Tran, Y. Gong, T. Rabczuk. Variationally consistent Maxwell stress in flexoelectric structures under finite deformation and immersed in free space. Applied Mathematical Modelling (2025) 116327
  7. Y. Gong*, Y. Kou, Q. Yue*, X. Zhuang*, N. Valizadeh, F. Qin, Q. Wang, T. Rabczuk. A phase-field study on thermo-mechanical coupled damage evolution and failure mechanisms of sintered silver interconnections. Engineering Fracture Mechanics (2025) 111039
  8. Y. Gong*, Y. He, H. Hu, X. Zhuang*, F. Qin, H. Xu, T. Rabczuk. A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures. Engineering Structures 326 (2025) 119500
  9. H. Liu, F. Wang*, S. Cheng, L. Qiu, Y. Gong. Shape optimization of sound barriers using an isogeometric meshless method. Physics of Fluids 36(2) (2024) 027116
  10. S. Li, Y. Gong*, F. Qin, P. Chen. Virtual Element Method for Thermomechanical Problems in Electronic Packaging. 2025 26th International Conference on Electronic Packaging Technology (ICEPT) (2025) 1-6

    11. 2024

  11. Y. Gong, Y. Kou, Q. Yue*, X. Zhuang*, F. Qin, Q. Wang, T. Rabczuk. The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures. International Communications in Heat and Mass Transfer 159 (2024) 108033
  12. Y. He, Y. Gong*, H. Xu, F. Qin. A FEM-BEM Coupling Scheme for Elastic Dynamics Problems in Electronic Packaging. 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (2024) 1-5
  13. S. Song, T. An*, F. Qin, Y. Gong, Y. Dai, P. Chen. Effect of Different Solder Layer Damage on Junction Temperature of IGBT Module. 2024 25th International Conference on Electronic Packaging Technology (ICEPT) (2024) 1-4

    14. 2023

  14. F. Qin, Q. He, Y. Gong*, C. Hou, H. Cheng, T. An, Y. Dai, P. Chen. An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging. Journal of Electronic Packaging 145(2) (2023)
  15. H. Xu, Y. Gong*, Y. Kou, F. Qin. An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging. 2023 24th International Conference on Electronic Packaging Technology (ICEPT) (2023)
  16. T. An, X. Chen, Q. Wang, J. Han*, F. Qin, Y. Dai, P. Chen, Y. Gong. Effect of Si segregation at grain boundaries on the mechanical behaviours of ageing Al metallization layer in insulated gate bipolar transistor module. Molecular Simulation 49(13-14) (2023) 1281-1292
  17. Y. Dai*, S. Zhao, F. Qin*, T. An, Y. Gong, P. Chen. Shear fracture resistance enhancement through micropatterning on copper substrate for sintered nano silver joints. International Journal of Adhesion and Adhesives 125 (2023) 103422
  18. M. Zhang, F. Qin*, S. Chen, Y. Dai*, Y. Jin, P. Chen, T. An, Y. Gong. Holding time effect on mechanical properties and protrusion behaviors of through silicon via copper under various annealing processes. Materials Science in Semiconductor Processing 158 (2023) 107353
  19. T. An*, R. Zhou, F. Qin*, Y. Dai, Y. Gong, P. Chen. Comparative Study of the Parameter Acquisition Methods for the Cauer Thermal Network Model of an IGBT Module. Electronics 12(7) (2023) 1650
  20. M. Zhang, F. Qin*, S. Chen, Y. Dai, Y. Jin, P. Chen, T. An, Y. Gong. Effect of Capped Cu Layer on Protrusion Behaviors of Through Silicon via Copper (TSV-Cu) Under Double Annealing Conditions: Comparative Study. IEEE Transactions on Device and Materials Reliability 23(1) (2023) 89-98

    21. 2022

  21. F. Wang*, Z. Chen, Y. Gong*. Local knot method for solving inverse Cauchy problems of Helmholtz equations on complicated two‐ and three‐dimensional domains. International Journal for Numerical Methods in Engineering 123(20) (2022) 4877-4892
  22. F. Qin, Q. He, Y. Gong*, T. An, P. Chen, Y. Dai. The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure. Engineering Analysis with Boundary Elements 137 (2022) 78-90
  23. Y. Gong*, F. Qin, C. Dong, J. Trevelyan. An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources. Applied Mathematical Modelling 109 (2022) 161-185
  24. B. Yu, G. Cao, S. Ren, Y. Gong, C. Dong*. An isogeometric boundary element method for transient heat transfer problems in inhomogeneous materials and the non-iterative inversion of loads. Applied Thermal Engineering 212 (2022) 118600
  25. F. Qin, S. Zhao, Y. Dai*, Y. Hu, T. An, Y. Gong. Mud-Cracking Effect of Sintered Silver Layer on Quantifying Heat Transfer Behavior of SiC Devices Under Power Cycling: Voronoi Tessellation Model. IEEE Transactions on Components, Packaging and Manufacturing Technology 12(6) (2022) 964-972
  26. S. Zhao, Y. Dai*, F. Qin, Y. Li, T. An, Y. Gong. Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints. Engineering Fracture Mechanics 264 (2022) 108355
  27. L. Chen, H. Lian, Z. Liu, Y. Gong, C. Zheng, S. Bordas*. Bi-material topology optimization for fully coupled structural-acoustic systems with isogeometric FEM–BEM. Engineering Analysis with Boundary Elements 135 (2022) 182-195
  28. T. An*, Z. Li, Y. Zhang, F. Qin, L. Wang, Z. Lin, X. Tang, Y. Dai, Y. Gong, P. Chen. The Effect of the Surface Roughness Characteristics of the Contact Interface on the Thermal Contact Resistance of the PP-IGBT Module. IEEE Transactions on Power Electronics 37(6) (2022) 7286-7298
  29. C. Ma, F. Qin, Y. Gong*, C. Hou, H. Cheng, Q. He. A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (2022) 1-4
  30. T. An*, Y. Tian, F. Qin, Y. Dai, Y. Gong, P. Chen. Comparison of junction temperature variations of IGBT modules under DC and PWM power cycling test conditions. Journal of Power Electronics 22(9) (2022) 1561-1575
  31. S. Zhao, S. Chen, F. Qin*, Y. Dai, Y. Gong. Thermal stress analysis of wafer-level multilayer stacking process for 3D-TSV packaging. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (2022) 1-4
  32. R. Zhou, T. An*, F. Qin, Y. Gong, Y. Dai, P. Chen. Influence of chip layout on temperature distribution of multi-chip press pack IGBT devices. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (2022) 1-4
  33. Y. Tian, T. An*, F. Qin, Y. Gong, Y. Dai, Y. Chen. Stress analysis of automotive IGBT module under vibration load. 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (2022) 1-4

    34. 2021

  34. H. Yu, Y. Guo, Y. Gong*, F. Qin. Thermal analysis of electronic packaging structure using isogeometric boundary element method. Engineering Analysis with Boundary Elements 128 (2021) 195-202
  35. C. Wang, F. Wang*, Y. Gong*. Analysis of 2D heat conduction in nonlinear functionally graded materials using a local semi-analytical meshless method. AIMS Mathematics 6(11) (2021) 12599-12618
  36. B. Yu*, G. Cao, Z. Meng, Y. Gong, C. Dong. Three-dimensional transient heat conduction problems in FGMs via IG-DRBEM. Computer Methods in Applied Mechanics and Engineering 384 (2021) 113958
  37. B. Yu, G. Cao, Y. Gong*, S. Ren, C. Dong. IG-DRBEM of three-dimensional transient heat conduction problems. Engineering Analysis with Boundary Elements 128 (2021) 298-309
  38. F. Qin, L. Zhang, P. Chen*, T. An, Y. Dai, Y. Gong, Z. Yi, H. Wang. In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process. Mechanical Systems and Signal Processing 154 (2021) 107550
  39. F. Qin, S. Zhao, L. Liu, Y. Dai*, T. An, P. Chen, Y. Gong. Thickness and metallization layer effect on interfacial and vertical cracking of sintered silver layer: A numerical investigation. Microelectronics Reliability 124 (2021) 114290
  40. S. Zhao, Y. Dai*, F. Qin**, Y. Li, L. Liu, Z. Zan, T. An, P. Chen, Y. Gong, Y. Wang. On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters. Materials Science and Engineering: A 823 (2021) 141729

    41. 2020

  41. Y. Gong*, C. Dong, F. Qin, G. Hattori, J. Trevelyan. Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures. Computer Methods in Applied Mechanics and Engineering 367 (2020) 113099
  42. F. Sun, Y. Gong, C. Dong*. A novel fast direct solver for 3D elastic inclusion problems with the isogeometric boundary element method. Journal of Computational and Applied Mathematics 377 (2020) 112904
  43. Y. Guo, H. Yu, Y. Gong*, F. Qin. Thermal analysis of IGBT by isogeometric boundary element method. 2020 21st International Conference on Electronic Packaging Technology (ICEPT) (2020) 1-5
  44. F. Qin, Y. Hu, Y. Dai*, T. An, P. Chen, Y. Gong, H. Yu. Crack Effect on the Equivalent Thermal Conductivity of Porously Sintered Silver. Journal of Electronic Materials 49(10) (2020) 5994-6008

    45. 2019

  45. Y. Gong, J. Trevelyan, G. Hattori, C. Dong*. Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures. Computer Methods in Applied Mechanics and Engineering 346 (2019) 642-673
  46. Y. Gong, H. Yang, C. Dong*. A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions. Computational Mechanics 63(2) (2019) 181-199
  47. F. Sun, C. Dong*, Y. Wu, Y. Gong. Fast direct isogeometric boundary element method for 3D potential problems based on HODLR matrix. Applied Mathematics and Computation 359 (2019) 17-33

    48. 2018

  48. Y. Gong, C. Dong*, X. Qu. An adaptive isogeometric boundary element method for predicting the effective thermal conductivity of steady state heterogeneity. Advances in Engineering Software 119 (2018) 103-115
  49. X. Qu, C. Dong*, Y. Bai, Y. Gong. Isogeometric boundary element method for calculating effective property of steady state thermal conduction in 2D heterogeneities with a homogeneous interphase. Journal of Computational and Applied Mathematics 343 (2018) 124-138

    50. 2017

  50. Y. Gong, C. Dong*, X. Qin. An isogeometric boundary element method for three dimensional potential problems. Journal of Computational and Applied Mathematics 313 (2017) 454-468
  51. Y. Gong, C. Dong*, Y. Bai. Evaluation of nearly singular integrals in isogeometric boundary element method. Engineering Analysis with Boundary Elements 75 (2017) 21-35
  52. Y. Gong, C. Dong*. An isogeometric boundary element method using adaptive integral method for 3D potential problems. Journal of Computational and Applied Mathematics 319 (2017) 141-158
  53. X. Qin, C. Dong*, F. Wang, Y. Gong. Free vibration analysis of isogeometric curvilinearly stiffened shells. Thin-Walled Structures 116 (2017) 124-135

    54. 2015

  54. Y. Zhang*, Y. Gong, X. Gao. Calculation of 2D nearly singular integrals over high-order geometry elements using the sinh transformation. Engineering Analysis with Boundary Elements 60 (2015) 144-153
  55. X. Li, Y. Zhang*, Y. Gong, Y. Su, X. Gao. Use of the sinh transformation for evaluating 2D nearly singular integrals in 3D BEM. Acta Mechanica 226(9) (2015) 2873-2885
  56. Y. Gong, Z. Jiang*, Y. Gao. On Jacobsthal and Jacobsthal-Lucas Circulant Type Matrices. Abstract and Applied Analysis 2015 (2015) 418293

    57. Other writings

  57. C. Ma, Y. Gong*, C. Hou, F. Qin. Analysis of FEM-BEM Coupling Method for Structures in Electronic Packaging (in Chinese). Structure & Environment Engineering 49(5) (2022)
  58. S. Zhao, Y. Gong*, C. Hou, F. Qin. Application of Direct Multilevel Finite Element Method in Multiscale Package Structures (in Chinese). Structure & Environment Engineering 49(5) (2022)
  59. G. Sun, Y. Gong*, C. Hou, Y. Li, F. Qin. Multiscale Package Structure Analysis Method Based on RVE-Submodel Method (in Chinese). Structure & Environment Engineering 49(3) (2022)

    60. 专著与书籍章节 Books & Book Chapters

  60. C. Dong, Y. Gong, F. Sun. Isogeometric Boundary Element Method (等几何边界元法). Science Press, Beijing, 1st Edition (May 2023) ISBN: 9787030742926