课题组动态 News

课题组最新动态和重要消息 | Latest news and updates from our research group

2026

9 月 3 日，庄晓莹（同济大学）牵头，与公颜鹏（北京工业大学）、金亚斌（复旦大学）、郭宏伟（北京工业大学）共同组织中国计算力学大会2026（CCCM2026）专题 MS24：数据与物理融合的力学模型探索与预测，诚邀同行及研究生投稿交流！专题聚焦物理与数据融合建模、力学规律发现、物理信息学习、神经算子、参数反演及多尺度多物理场预测。会议将于 2026 年 11 月 6–9 日在武汉召开，摘要投稿截止日期为 9 月 20 日（仅需提交摘要）。[会议官网与投稿]
September 3, 2026 — Xiaoying Zhuang (lead organizer), Yanpeng Gong, Yabin Jin, and Hongwei Guo are co-organizing MS24: Data-Physics Integration for Mechanics Model Discovery and Prediction at CCCM2026. The symposium welcomes contributions on physics-data-integrated modeling, discovery of mechanics laws, physics-informed learning, neural operators, inverse problems, and multiscale and multiphysics prediction. The conference will take place in Wuhan, China, November 6–9, 2026. Researchers and graduate students are warmly invited to submit an abstract by September 20, 2026; no full paper is required. [Conference & submission]
8 月 11 日，公颜鹏在香港举办的第 32 届国际计算与实验工程和科学会议（ICCES2026）作邀请报告“A Stochastic Phase-Field Model for Probabilistic Fracture Analysis of Brittle Materials: Numerical Framework and Experimental Validation”。
August 11, 2026 — Yanpeng Gong delivered an invited talk entitled “A Stochastic Phase-Field Model for Probabilistic Fracture Analysis of Brittle Materials: Numerical Framework and Experimental Validation” at the 32nd International Conference on Computational & Experimental Engineering and Sciences (ICCES2026) in Hong Kong.
6 月 26 日，祝贺硕士生贺一达、李思帅参加北京工业大学 2026 届毕业典礼并顺利毕业！两人的硕士学位论文均获北京工业大学优秀毕业论文。贺一达入职北京华航无线电测量研究所，李思帅入职北京曙光航空电气有限责任公司。
June 26, 2026 — Congratulations to Yida He and Sishuai Li on their graduation. Both Master’s theses were recognized as BJUT Outstanding Master’s Theses.
6 月 1 日，公颜鹏的 Google Scholar 引用总数突破 1000 次。感谢多年来合作者们的支持，以及课题组同学们的共同努力。[Google Scholar 通知]
June 1, 2026 — My Google Scholar citations surpassed 1,000. Sincere thanks to my collaborators over the years and to the students in my group.
5 月 30 日，公颜鹏作为 Guest Editor 参与组织的 Scientific Reports 专题 “Advanced 3D Packaging and Integration” 正式开放投稿，截止日期 2027 年 2 月 11 日。客座编辑团队：Yanpeng Gong（北京工业大学）、Ji-Wei Lian、Uma Sathyakam P、Shih-Kang Lin。诚邀同行投稿！[宣传图]
The Scientific Reports Collection “Advanced 3D Packaging and Integration”, co-edited by Yanpeng Gong, Ji-Wei Lian, Uma Sathyakam P, and Shih-Kang Lin, is now open for submissions (deadline: 11 February 2027). Contributions are warmly welcome.
5 月 11 日，恭喜硕士生贺一达、李思帅顺利通过硕士学位论文答辩！Congratulations to Yida He and Sishuai Li for successfully passing their Master’s thesis defense!
1 月 31 日，公颜鹏入选《电子与封装》期刊2026 年青年编委。Yanpeng Gong has been appointed as a Young Editorial Board Member of Electronics & Packaging journal for 2026.
1 月 16 日，恭喜硕士生贺一达在“2025 年第七届全球校园人工智能算法精英大赛全国总决赛”中荣获一等奖（赛题：AI+力学）[获奖证书]。Congratulations to Yida He for winning the First Prize in the 7th Global Campus AI Algorithm Elite Competition National Finals (Topic: AI+Mechanics).

2025

11 月 29 日，公颜鹏参加“第 136 期高端青年沙龙——含能复合材料失效行为表征与分析研讨会”（中国复合材料学会，北京），并作报告”多尺度数值计算方法及其工程应用”。[会议通知] [日程表]
11 月 7 日，恭喜硕士生贺一达获得国家奖学金和一等学业奖学金，李思帅获得三等学业奖学金。Congratulations to Yida He for receiving the National Scholarship and First-Class Academic Scholarship, and to Sishuai Li for receiving the Third-Class Academic Scholarship.
10 月 25 日，公颜鹏在CCOME2025获“杜庆华工程计算方法优秀青年学者奖”，并应邀作大会主旨报告”基于虚单元法的多尺度电子封装热力耦合分析”。[获奖证书]
Yanpeng Gong received the DU Qing-Hua Medal & Young Researcher Award of Computational Methods in Engineering at CCOME2025 in Nanchang, and delivered a plenary talk on virtual element method for electronic packaging.
10 月 16 日，公颜鹏受聘为Scientific Reports编委会成员（Editorial Board Member）。应邀参加在北京航空航天大学举办的编委会会议，与主编及北京地区编委就期刊发展及学术管理进行讨论。[会议证明]
Yanpeng Gong was appointed as an Editorial Board Member of Scientific Reports. On October 16th, he attended the editorial board meeting at Beihang University, discussing journal development and academic management with the Chief Editor and board members from Beijing.
10 月 10-12 日，公颜鹏在DACOMA25 会议作邀请报告”Energy-Based Physics-Informed Kolmogorov-Arnold Networks for Multi-Scale Multi-Material Electronic Packaging Structures”，研究生贺一达作口头报告”Physics-Informed Neural Operator for Multi-Material Elasticity Problems in Electronic Packaging”。
9 月 26 日，公颜鹏获聘为《应用力学学报》青年编辑委员会委员。Yanpeng Gong was appointed as a member of the Young Editorial Board of Chinese Journal of Applied Mechanics (应用力学学报).
9 月 8 日，欢迎杨东晋、张宇喆同学加入课题组，攻读硕士研究生学位！
2 月 28 日，公颜鹏完成德国洪堡基金会博士后研究项目，从莱布尼兹-汉诺威大学返回北京工业大学。

2024

9 月 10 日，欢迎张乐通、宋锦泉同学加入课题组，攻读硕士研究生学位！

2023

9 月 10 日，欢迎贺一达、李思帅同学加入课题组，攻读硕士研究生学位！
1 月 1 日，公颜鹏获德国洪堡基金会资助，赴莱布尼兹-汉诺威大学开展博士后研究项目。Yanpeng Gong received funding from the Alexander von Humboldt Foundation and commenced his postdoctoral research at Leibniz University Hannover.

2022

9 月 10 日，欢迎寇玉国同学加入课题组，攻读硕士研究生学位！
2022 年 4 月 1 日起，公颜鹏受聘为北京工业大学副研究员（副高级）。Yanpeng Gong was appointed as Associate Professor at Beijing University of Technology.

2021

9 月 8 日，欢迎徐浩同学加入课题组，攻读硕士研究生学位！

2020

2019

7 月 4 日，公颜鹏正式入职北京工业大学。