In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process
Published in Mechanical Systems and Signal Processing, 2021
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Recommended citation: Fei Qin, Lixiang Zhang, Pei Chen, Tong An, Yanwei Dai, Yanpeng Gong, Zhongbo Yi, Haiming Wang, "In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process." Mechanical Systems and Signal Processing, 2021.