A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging
Published in ICEPT, 2022
A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging
Recommended citation: Ma, C.; Qin, F.; Gong, Y.; Hou, C.; Cheng, H.; He, Q. (2022). “A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging.” 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). pp.1-4.
Recommended citation: Ma, C.; Qin, F.; Gong, Y.; Hou, C.; Cheng, H.; He, Q. (2022). "A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging." 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). pp.1-4.
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