An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources
Published in Applied Mathematical Modelling, 2022
An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources
Recommended citation: Gong, Yanpeng; Qin, Fei; Dong, Chunying; Trevelyan, Jon. (2022). “An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources.” Applied Mathematical Modelling. 109(161-185).
Recommended citation: Gong, Yanpeng; Qin, Fei; Dong, Chunying; Trevelyan, Jon. (2022). "An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources." Applied Mathematical Modelling. 109(161-185).
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