Thermal analysis of electronic packaging structure using isogeometric boundary element method
Published in Engineering Analysis with Boundary Elements, 2021
Thermal analysis of electronic packaging structure using isogeometric boundary element method
Recommended citation: Yu, Huiping; Guo, Yubo; Gong, Yanpeng; Qin, Fei. (2021). “Thermal analysis of electronic packaging structure using isogeometric boundary element method.” Engineering Analysis with Boundary Elements. 128:195-202.
Recommended citation: Yu, Huiping; Guo, Yubo; Gong, Yanpeng; Qin, Fei. (2021). "Thermal analysis of electronic packaging structure using isogeometric boundary element method." Engineering Analysis with Boundary Elements. 128:195-202.
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