In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process
Published in Mechanical Systems and Signal Processing, 2021
In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process
Recommended citation: Qin, Fei; Zhang, Lixiang; Chen, Pei; An, Tong; Dai, Yanwei; Gong, Yanpeng; Yi, Zhongbo; Wang, Haiming. (2021). “In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process.” Mechanical Systems and Signal Processing. 154.
Recommended citation: Qin, Fei; Zhang, Lixiang; Chen, Pei; An, Tong; Dai, Yanwei; Gong, Yanpeng; Yi, Zhongbo; Wang, Haiming. (2021). "In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process." Mechanical Systems and Signal Processing. 154.
Download Paper