A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging
Published in In the proceedings of 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022
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Recommended citation: C. Ma, F. Qin, Y. Gong, C. Hou, H. Cheng, Q. He, "A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging." In the proceedings of 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022.