An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources
Published in Applied Mathematical Modelling, 2022
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Recommended citation: Yanpeng Gong, Fei Qin, Chunying Dong, Jon Trevelyan, "An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources." Applied Mathematical Modelling, 2022.