An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging
Published in In the proceedings of 2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023
Use Google Scholar for full citation
Recommended citation: Hao Xu, Yanpeng Gong, Yuguo Kou, Fei Qin, "An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging." In the proceedings of 2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023.