An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging
Published in Journal of Electronic Packaging, 2023
An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging
Recommended citation: Qin, Fei; He, Qi; Gong, Yanpeng; Hou, Chuantao; Cheng, Hao; An, Tong; Dai, Yanwei; Chen, Pei. (2023). “An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging.” Journal of Electronic Packaging. 145(2).
Recommended citation: Qin, Fei; He, Qi; Gong, Yanpeng; Hou, Chuantao; Cheng, Hao; An, Tong; Dai, Yanwei; Chen, Pei. (2023). "An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging." Journal of Electronic Packaging. 145(2).
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