Yanpeng Gong

Yanpeng Gong

Associate Researcher at BJUT | Humboldt Research Fellow

An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging

Published in IEEE, 2023

Download paper here

An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging

Recommended citation: Xu, Hao; Gong, Yanpeng; Kou, Yuguo; Qin, Fei. (2023). “An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging.” IEEE.

Recommended citation: Xu, Hao; Gong, Yanpeng; Kou, Yuguo; Qin, Fei. (2023). "An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging." IEEE.
Download Paper