Yanpeng Gong

Yanpeng Gong

Associate Researcher at BJUT | Humboldt Research Fellow

The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures

Published in International Communications in Heat and Mass Transfer, 2024

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Recommended citation: Yanpeng Gong, Yuguo Kou, Qiang Yue, Xiaoying Zhuang, Fei Qin, Qiao Wang, Timon Rabczuk, "The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures." International Communications in Heat and Mass Transfer, 2024.
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