The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures
Published in International Communications in Heat and Mass Transfer, 2024
To achieve high-density, high-reliability integrated packaging interconnects, 3D packaging technology has become a focus of current research…
Recommended citation: Gong, Yanpeng; Kou, Yuguo; Yue, Qiang; Zhuang, Xiaoying; Qin, Fei; Wang, Qiao; Rabczuk, Timon. (2024). “The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures.” International Communications in Heat and Mass Transfer. 159(108033).
Recommended citation: Gong, Yanpeng; Kou, Yuguo; Yue, Qiang; Zhuang, Xiaoying; Qin, Fei; Wang, Qiao; Rabczuk, Timon. (2024). "The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures." International Communications in Heat and Mass Transfer. 159(108033).
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