科学研究 Research

数值方法与软件开发 Numerical Methods & Software Development

Keywords: Isogeometric analysis, Phase field, PINN, Boundary element method, FEM-BEM coupling, ABAQUS integration

我们致力于解决复杂工程问题中的关键数值计算挑战，开发高效的计算方法和软件工具。研究涵盖电子封装热-力-电多物理场耦合分析、软体机器人力学仿真、先进材料失效预测等前沿工程问题，特别是在等几何分析、相场法、机器学习、边界元法、虚单元法及商业软件二次开发等计算力学先进数值方法方面，开展深入的理论研究与工程应用。 We are committed to solving critical numerical computational challenges in complex engineering problems by developing efficient computational methods and software tools. Our research addresses cutting-edge engineering challenges including thermo-electro-mechanical multi-physics coupling analysis in electronic packaging, soft robotics mechanical simulation, and advanced material failure prediction, with particular expertise in advanced numerical methods of computational mechanics such as isogeometric analysis, phase-field methods, machine learning, boundary element methods, virtual element methods, and commercial software secondary development.

  1. Y. Gong*, S. Li, Y. Mei, B. Xu, F. Qin, X. Zhuang, T. Rabczuk. A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures. Engineering Analysis with Boundary Elements 184, 106640 (2026) [arXiv] FE-VE coupling for complex geometries

  2. Y. Gong*, S. Li, F. Qin, B. Xu. Virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features. Engineering with Computers 41, 4799-4824 (2025) [arXiv] Novel VEM implementation for multi-scale problems

  3. Y. Gong*, Y. He, H. Hu, X. Zhuang, F. Qin, H. Xu, T. Rabczuk. A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures. Engineering Structures 326, 119500 (2025) FEM-BEM coupling implementation in ABAQUS

  4. Y. Gong*, F. Qin, C. Dong, J. Trevelyan. An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources. Applied Mathematical Modelling 109, 161-185 (2022) Domain integral conversion algorithms

  5. Y. Gong*, C. Dong, F. Qin, G. Hattori, J. Trevelyan. Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures. Computer Methods in Applied Mechanics and Engineering 367, 113099 (2020) Novel integration algorithms for thin structures

  6. Y. Gong*, J. Trevelyan, G. Hattori, C. Dong. Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures. Computer Methods in Applied Mechanics and Engineering 346, 642-673 (2019) Adaptive integration schemes

  7. F. Qin*, Q. He, Y. Gong, T. An, P. Chen, Y. Dai. The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure. Engineering Analysis with Boundary Elements 137, 78-90 (2022) Automatic coupling implementation in ABAQUS via UEL

电子封装可靠性分析 Electronic Packaging Reliability

Keywords: Multi-scale structures, Multi-physics coupling, Thermal cycling, Phase-field modeling, IGBT modules, TSV structures, Advanced numerical techniques, Reliability prediction

针对电子封装结构在复杂服役环境下的可靠性问题，我们建立多尺度、多物理场耦合的数值分析方法，重点研究热循环载荷下的材料损伤演化、界面失效机制及可靠性预测技术，为电子器件的设计优化和寿命评估提供理论支撑和工程指导。Addressing reliability issues of electronic packaging structures under complex service environments, we develop multiscale and multi-physics coupling numerical analysis methods, focusing on material damage evolution under thermal cycling, interface failure mechanisms, and reliability prediction technologies, providing theoretical support and engineering guidance for design optimization and lifetime assessment of electronic devices.

  1. Y. Gong*, Y. Kou, Q. Yue, X. Zhuang, N. Valizadeh, F. Qin, Q. Wang, T. Rabczuk. A phase-field study on thermo-mechanical coupled damage evolution and failure mechanisms of sintered silver interconnections. Engineering Fracture Mechanics 111039 (2025) Mixed-mode fracture modeling in porous structures

  2. Y. Gong*, Y. Kou, Q. Yue, X. Zhuang, F. Qin, Q. Wang, T. Rabczuk. The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures. International Communications in Heat and Mass Transfer 159, 108033 (2024) TSV and TGV structure analysis

机器学习与计算力学 Machine Learning in Computational Mechanics

Keywords: Physics-informed neural networks, Kolmogorov-Arnold networks, Deep learning, Data-driven modeling, Multi-material problems, Surrogate modeling, AI-enhanced simulation

探索机器学习与传统计算力学的深度融合，开发物理驱动的智能计算方法，重点研究基于物理约束的神经网络、新型网络架构在复杂工程问题中的应用，以及数据驱动的材料建模与仿真加速技术。Exploring the deep integration of machine learning with traditional computational mechanics, we develop physics-driven intelligent computational methods, focusing on physics-constrained neural networks, novel network architectures for complex engineering problems, and data-driven material modeling and simulation acceleration techniques.

  1. Y. Gong*, Y. He, Y. Mei, X. Zhuang, F. Qin, T. Rabczuk. Physics-informed Kolmogorov-Arnold Networks for multi-material elasticity problems in electronic packaging. Applied Mathematical Modelling 156, 116793 (2026) [arXiv] Novel KAN architecture for physics-informed learning

智能软材料与软体机器人力学 Smart Soft Materials & Soft Robotics Mechanics

Keywords: Magnetic actuation, Flexoelectricity, Soft materials, Nonlinear deformation, Multi-physics coupling, Dynamic simulation, Bio-inspired design, Smart actuators

研究智能软材料的多物理场耦合行为及其在软体机器人中的应用，包括挠曲电材料的力-电耦合特性、磁驱动软体结构的大变形力学行为，建立智能软材料的多尺度建模方法，为新型软体驱动器和传感器设计提供理论基础。Investigating multi-physics coupling behaviors of smart soft materials and their applications in soft robotics, including electro-mechanical coupling characteristics of flexoelectric materials and large deformation mechanical behaviors of magnetically actuated soft structures, establishing multiscale modeling methods for smart soft materials to provide theoretical foundation for novel soft actuators and sensors.

  1. X. Zhuang, H. Hu, S. S. Nanthakumar, Q.-T. Tran, Y. Gong, T. Rabczuk*. Variationally consistent Maxwell stress in flexoelectric structures under finite deformation and immersed in free space. Applied Mathematical Modelling 116327 (2025) Flexoelectric modeling under large deformation

  2. 磁驱动软体机器人多物理场耦合建模与力学仿真 (Multi-physics coupling modeling and dynamic simulation of magnetically actuated soft robots)

研究资助 Research Grants

My research has been supported by the following grants:

荣誉奖励 Fellowships & Awards

I am grateful for the generous financial support and award from the organization and community, including:

学术交流 Academic Exchange

International collaboration and visiting experiences: