Yanpeng Gong

Yanpeng Gong

Associate Researcher at BJUT | Humboldt Research Fellow

Posts by Collection

portfolio

publications

Calculation of 2D nearly singular integrals over high-order geometry elements using the sinh transformation

Published in Engineering Analysis with Boundary Elements, 2015

Calculation of 2D nearly singular integrals over high-order geometry elements using the sinh transformation Read more

Recommended citation: Zhang, Yaoming; Gong, Yanpeng; Gao, Xiaowei. (2015). "Calculation of 2D nearly singular integrals over high-order geometry elements using the sinh transformation." Engineering Analysis with Boundary Elements. 60:144-153.
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An adaptive isogeometric boundary element method for predicting the effective thermal conductivity of steady state heterogeneity

Published in Advances in Engineering Software, 2018

An adaptive isogeometric boundary element method for predicting the effective thermal conductivity of steady state heterogeneity Read more

Recommended citation: Gong, Y.P.; Dong, C.Y.; Qu, X.Y. (2018). "An adaptive isogeometric boundary element method for predicting the effective thermal conductivity of steady state heterogeneity." Advances in Engineering Software. 119:103-115.
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A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions

Published in Computational Mechanics, 2018

A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions Read more

Recommended citation: Gong, Y.P.; Yang, H.S.; Dong, C.Y. (2018). "A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions." Computational Mechanics. 63(2):181-199.
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A Comparison of nearly singular integrals evaluation method for isogeometric boundary element method ( IGABEM )

Published in In the proceedings of 6th European Conference on Computational Mechanics (ECCM 6) & 7th European Conference on Computational Fluid Dynamics (ECFD 7), Glasgow, UK, 11-15 June 2018, 2018

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Recommended citation: Yanpeng Gong, Gabriel Hattori, Jon Trevelyan, Chunying Dong, "A Comparison of nearly singular integrals evaluation method for isogeometric boundary element method ( IGABEM )." In the proceedings of 6th European Conference on Computational Mechanics (ECCM 6) & 7th European Conference on Computational Fluid Dynamics (ECFD 7), Glasgow, UK, 11-15 June 2018, 2018.

Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures

Published in Computer Methods in Applied Mechanics and Engineering, 2019

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Recommended citation: Yanpeng Gong, Jon Trevelyan, Gabriel Hattori, Chunying Dong, "Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures." Computer Methods in Applied Mechanics and Engineering, 2019.

Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures

Published in Computer Methods in Applied Mechanics and Engineering, 2019

Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures Read more

Recommended citation: Gong, Yanpeng; Trevelyan, Jon; Hattori, Gabriel; Dong, Chunying. (2019). "Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures." Computer Methods in Applied Mechanics and Engineering. 346:642-673.
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Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures

Published in Computer Methods in Applied Mechanics and Engineering, 2020

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Recommended citation: Yanpeng Gong, Chunying Dong, Fei Qin, Gabriel Hattori, Jon Trevelyan, "Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures." Computer Methods in Applied Mechanics and Engineering, 2020.

Thermal analysis of IGBT by isogeometric boundary element method

Published in In the proceedings of 2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020

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Recommended citation: Yubo Guo, Huiping Yu, Yanpeng Gong, Fei Qin, "Thermal analysis of IGBT by isogeometric boundary element method." In the proceedings of 2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020.

Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures

Published in Computer Methods in Applied Mechanics and Engineering, 2020

Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures Read more

Recommended citation: Gong, Yanpeng; Dong, Chunying; Qin, Fei; Hattori, Gabriel; Trevelyan, Jon. (2020). "Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures." Computer Methods in Applied Mechanics and Engineering. 367.
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Thermal analysis of electronic packaging structure using isogeometric boundary element method

Published in Engineering Analysis with Boundary Elements, 2021

Thermal analysis of electronic packaging structure using isogeometric boundary element method Read more

Recommended citation: Yu, Huiping; Guo, Yubo; Gong, Yanpeng; Qin, Fei. (2021). "Thermal analysis of electronic packaging structure using isogeometric boundary element method." Engineering Analysis with Boundary Elements. 128:195-202.
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In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process

Published in Mechanical Systems and Signal Processing, 2021

In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process Read more

Recommended citation: Qin, Fei; Zhang, Lixiang; Chen, Pei; An, Tong; Dai, Yanwei; Gong, Yanpeng; Yi, Zhongbo; Wang, Haiming. (2021). "In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process." Mechanical Systems and Signal Processing. 154.
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A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging

Published in In the proceedings of 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022

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Recommended citation: C. Ma, F. Qin, Y. Gong, C. Hou, H. Cheng, Q. He, "A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging." In the proceedings of 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022.

A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging

Published in ICEPT, 2022

A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging Read more

Recommended citation: Ma, C.; Qin, F.; Gong, Y.; Hou, C.; Cheng, H.; He, Q. (2022). "A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging." 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). pp.1-4.
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The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure

Published in Engineering Analysis with Boundary Elements, 2022

The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure Read more

Recommended citation: Qin, Fei; He, Qi; Gong, Yanpeng; An, Tong; Chen, Pei; Dai, Yanwei. (2022). "The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure." Engineering Analysis with Boundary Elements. 137(78-90).
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An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

Published in Applied Mathematical Modelling, 2022

An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources Read more

Recommended citation: Gong, Yanpeng; Qin, Fei; Dong, Chunying; Trevelyan, Jon. (2022). "An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources." Applied Mathematical Modelling. 109(161-185).
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An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging

Published in Journal of Electronic Packaging, 2023

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Recommended citation: Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen, "An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging." Journal of Electronic Packaging, 2023.

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Published in Journal of Electronic Packaging, 2023

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Recommended citation: Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen, "An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging." Journal of Electronic Packaging, 2023.

An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging

Published in In the proceedings of 2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023

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Recommended citation: Hao Xu, Yanpeng Gong, Yuguo Kou, Fei Qin, "An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging." In the proceedings of 2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023.

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging

Published in Journal of Electronic Packaging, 2023

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging Read more

Recommended citation: Qin, Fei; He, Qi; Gong, Yanpeng; Hou, Chuantao; Cheng, Hao; An, Tong; Dai, Yanwei; Chen, Pei. (2023). "An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging." Journal of Electronic Packaging. 145(2).
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The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures

Published in International Communications in Heat and Mass Transfer, 2024

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Recommended citation: Yanpeng Gong, Yuguo Kou, Qiang Yue, Xiaoying Zhuang, Fei Qin, Qiao Wang, Timon Rabczuk, "The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures." International Communications in Heat and Mass Transfer, 2024.
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The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures

Published in International Communications in Heat and Mass Transfer, 2024

To achieve high-density, high-reliability integrated packaging interconnects, 3D packaging technology has become a focus of current research… Read more

Recommended citation: Gong, Yanpeng; Kou, Yuguo; Yue, Qiang; Zhuang, Xiaoying; Qin, Fei; Wang, Qiao; Rabczuk, Timon. (2024). "The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures." International Communications in Heat and Mass Transfer. 159(108033).
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talks

teaching

Introduction of Abaqus and its Python Scripts

Undergraduate Course, Beijing University of Technology, Department of Mechanics, 2022

Course Objectives

This course aims to provide students with a comprehensive understanding of Abaqus finite element software and its applications, focusing on both practical operations and programming aspects. Read more

Engineering Numerical Simulation Technology and Development

Undergraduate Course, Beijing University of Technology, Department of Mechanics, 2022

Course Overview

An interdisciplinary course bridging mathematics, mechanics, materials science, mechanical engineering, integrated circuits, electronic packaging design, and intelligent manufacturing. It combines theoretical foundations with practical applications in modern engineering. Read more