CV

Education

Ph.D. in Mechanics, Beijing Institute of Technology, 2019
Exchange Ph.D. student, Department of Engineering, Durham University, UK, 2017-2018
M.Sc. in Computational Mathematics, Shandong University of Technology, 2015
B.Sc. in Applied Mathematics, Linyi University, 2012

Work Experience

2023-present: Humboldt Research Fellowship Programme for Postdocs
- Institute of Photonics, Leibniz University Hannover, Germany
2019-present: Associate Researcher
- Faculty of Materials and Manufacturing
- Beijing University of Technology, China

Research Interests

Computational mechanics
Boundary element method, isogeometric boundary element method, and isogeometric analysis
Phase-field modeling for electronic packaging reliability and fracture mechanics
Multiscale structure simulation
Flexoelectric nanostructures
High performance computing
Mechanical problems in electronics packaging
Numerical simulation of thin-walled or thin-coated systems
Computational software development

Honors and Awards

Alexander von Humboldt Research Fellowship, 2022-2025
Outstanding PhD graduates in Beijing, 2019
National Scholarship for Doctoral Student, 2017 (Ministry of Education of China)
Excellent bachelor dissertation in Shandong, 2013
Outstanding graduates in Shandong, 2013

Selected Projects

Principal Investigator (PI), “Study on isogeometric boundary element method for thermal stress analysis of multi-scale and multi-layer structures”, National Natural Science Foundation of China, 2021-2023
Principal Investigator (PI), “Numerical analysis of IGBT packaging module”, General Program of Science and Technology Development Project of Beijing Municipal Education Commission, 2021-2023
Principal Investigator (PI), “Study on the temperature/stress analysis of IGBT packaging module”, Beijing Postdoctoral Research Foundation, 2020-2021
Co-PI, “Study on fast direct isogeometric boundary element method for analysis of large-scale coating structures”, National Natural Science Foundation of China, 2020-2023
Co-PI, “Crack analysis of Aeroengine turbine blade by using isogeometric boundary element method”, National Natural Science Foundation of China, 2012-2013

Publications

A coupled finite element-boundary element method for transient elastic dynamic analysis of electronic packaging structures

Yanpeng Gong, Yida He, Han Hu, Xiaoying Zhuang, Fei Qin, Hao Xu, Timon Rabczuk, "A coupled finite element-boundary element method for transient elastic dynamic analysis of electronic packaging structures." Engineering Structures, 2025.

The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures

Gong, Yanpeng; Kou, Yuguo; Yue, Qiang; Zhuang, Xiaoying; Qin, Fei; Wang, Qiao; Rabczuk, Timon. (2024). "The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures." International Communications in Heat and Mass Transfer. 159(108033).

The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures

Yanpeng Gong, Yuguo Kou, Qiang Yue, Xiaoying Zhuang, Fei Qin, Qiao Wang, Timon Rabczuk, "The application of thermomechanically coupled phase-field models in electronic packaging interconnect structures." International Communications in Heat and Mass Transfer, 2024.

An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging

Xu, Hao; Gong, Yanpeng; Kou, Yuguo; Qin, Fei. (2023). "An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging." IEEE.

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging

Qin, Fei; He, Qi; Gong, Yanpeng; Hou, Chuantao; Cheng, Hao; An, Tong; Dai, Yanwei; Chen, Pei. (2023). "An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging." Journal of Electronic Packaging. 145(2).

An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging

Hao Xu, Yanpeng Gong, Yuguo Kou, Fei Qin, "An isogeometric boundary element scheme for transient heat transfer problems in electronic packaging." In the proceedings of 2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023.

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen, "An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging." Journal of Electronic Packaging, 2023.

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen, "An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic-Plastic Problems of Multiscale Structures in Electronic Packaging." Journal of Electronic Packaging, 2023.

An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

Gong, Yanpeng; Qin, Fei; Dong, Chunying; Trevelyan, Jon. (2022). "An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources." Applied Mathematical Modelling. 109(161-185).

The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure

Qin, Fei; He, Qi; Gong, Yanpeng; An, Tong; Chen, Pei; Dai, Yanwei. (2022). "The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure." Engineering Analysis with Boundary Elements. 137(78-90).

A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging

Ma, C.; Qin, F.; Gong, Y.; Hou, C.; Cheng, H.; He, Q. (2022). "A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging." 2022 23rd International Conference on Electronic Packaging Technology (ICEPT). pp.1-4.

The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure

Fei Qin, Qi He, Yanpeng Gong, Tong An, Pei Chen, Yanwei Dai, "The application of FEM-BEM coupling method for steady 2D heat transfer problems with multi-scale structure." Engineering Analysis with Boundary Elements, 2022.

An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

Yanpeng Gong, Fei Qin, Chunying Dong, Jon Trevelyan, "An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources." Applied Mathematical Modelling, 2022.

A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging

C. Ma, F. Qin, Y. Gong, C. Hou, H. Cheng, Q. He, "A novel coupling simulation scheme for elastoplastic problems of multiscale structures in electronic packaging." In the proceedings of 2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022.

In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process

Qin, Fei; Zhang, Lixiang; Chen, Pei; An, Tong; Dai, Yanwei; Gong, Yanpeng; Yi, Zhongbo; Wang, Haiming. (2021). "In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process." Mechanical Systems and Signal Processing. 154.

Thermal analysis of electronic packaging structure using isogeometric boundary element method

Yu, Huiping; Guo, Yubo; Gong, Yanpeng; Qin, Fei. (2021). "Thermal analysis of electronic packaging structure using isogeometric boundary element method." Engineering Analysis with Boundary Elements. 128:195-202.

IG-DRBEM of three-dimensional transient heat conduction problems

Yu, Bo; Cao, Geyong; Gong, Yanpeng; Ren, Shanhong; Dong, Chunying. (2021). "IG-DRBEM of three-dimensional transient heat conduction problems." Engineering Analysis with Boundary Elements. 128:298-309.

Three-dimensional transient heat conduction problems in FGMs via IG-DRBEM

Yu, Bo; Cao, Geyong; Meng, Zeng; Gong, Yanpeng; Dong, Chunying. (2021). "Three-dimensional transient heat conduction problems in FGMs via IG-DRBEM." Computer Methods in Applied Mechanics and Engineering. 384.

Application of a Fem-Bem Coupling Method in Steady-State Heat Transfer Problem

He, Q.I.; Gong, Yanpeng; Qin, F.E.I. (2021). "Application of a Fem-Bem Coupling Method in Steady-State Heat Transfer Problem." pp.121-130.

Three-dimensional transient heat conduction problems in FGMs via IG-DRBEM

Bo Yu, Geyong Cao, Zeng Meng, Yanpeng Gong, Chunying Dong, "Three-dimensional transient heat conduction problems in FGMs via IG-DRBEM." Computer Methods in Applied Mechanics and Engineering, 2021.

Thermal analysis of electronic packaging structure using isogeometric boundary element method

Huiping Yu, Yubo Guo, Yanpeng Gong, Fei Qin, "Thermal analysis of electronic packaging structure using isogeometric boundary element method." Engineering Analysis with Boundary Elements, 2021.

In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process

Fei Qin, Lixiang Zhang, Pei Chen, Tong An, Yanwei Dai, Yanpeng Gong, Zhongbo Yi, Haiming Wang, "In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process." Mechanical Systems and Signal Processing, 2021.

IG-DRBEM of three-dimensional transient heat conduction problems

Bo Yu, Geyong Cao, Yanpeng Gong, Shanhong Ren, Chunying Dong, "IG-DRBEM of three-dimensional transient heat conduction problems." Engineering Analysis with Boundary Elements, 2021.

Application of a Fem-Bem Coupling Method in Steady-State Heat Transfer Problem

Q. He, Yanpeng Gong, F. Qin, "Application of a Fem-Bem Coupling Method in Steady-State Heat Transfer Problem." In the proceedings of Boundary Elements and other Mesh Reduction Methods XLIV 2021, 2021.

Thermal analysis of IGBT by isogeometric boundary element method

Guo, Yubo; Yu, Huiping; Gong, Yanpeng; Qin, Fei. (2020). "Thermal analysis of IGBT by isogeometric boundary element method." 2020 21st International Conference on Electronic Packaging Technology (ICEPT). pp.1-5.

Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures

Gong, Yanpeng; Dong, Chunying; Qin, Fei; Hattori, Gabriel; Trevelyan, Jon. (2020). "Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures." Computer Methods in Applied Mechanics and Engineering. 367.

Thermal analysis of IGBT by isogeometric boundary element method

Yubo Guo, Huiping Yu, Yanpeng Gong, Fei Qin, "Thermal analysis of IGBT by isogeometric boundary element method." In the proceedings of 2020 21st International Conference on Electronic Packaging Technology (ICEPT), 2020.

Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures

Yanpeng Gong, Chunying Dong, Fei Qin, Gabriel Hattori, Jon Trevelyan, "Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures." Computer Methods in Applied Mechanics and Engineering, 2020.

Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures

Gong, Yanpeng; Trevelyan, Jon; Hattori, Gabriel; Dong, Chunying. (2019). "Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures." Computer Methods in Applied Mechanics and Engineering. 346:642-673.

Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures

Yanpeng Gong, Jon Trevelyan, Gabriel Hattori, Chunying Dong, "Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures." Computer Methods in Applied Mechanics and Engineering, 2019.

A Comparison of nearly singular integrals evaluation method for isogeometric boundary element method ( IGABEM )

Gong, Yanpeng; Hattori, Gabriel; Trevelyan, Jon; Dong, Chunying. (2018). "A Comparison of nearly singular integrals evaluation method for isogeometric boundary element method ( IGABEM )." 11-15 June 2018.

A Comparison of nearly singular integrals evaluation method for isogeometric boundary element method ( IGABEM )

Yanpeng Gong, Gabriel Hattori, Jon Trevelyan, Chunying Dong, "A Comparison of nearly singular integrals evaluation method for isogeometric boundary element method ( IGABEM )." In the proceedings of 6th European Conference on Computational Mechanics (ECCM 6) & 7th European Conference on Computational Fluid Dynamics (ECFD 7), Glasgow, UK, 11-15 June 2018, 2018.

A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions

Gong, Y.P.; Yang, H.S.; Dong, C.Y. (2018). "A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions." Computational Mechanics. 63(2):181-199.

An adaptive isogeometric boundary element method for predicting the effective thermal conductivity of steady state heterogeneity

Gong, Y.P.; Dong, C.Y.; Qu, X.Y. (2018). "An adaptive isogeometric boundary element method for predicting the effective thermal conductivity of steady state heterogeneity." Advances in Engineering Software. 119:103-115.

An adaptive isogeometric boundary element method for predicting the effective thermal conductivity of steady state heterogeneity

Y. Gong, C. Dong, X. Qu, "An adaptive isogeometric boundary element method for predicting the effective thermal conductivity of steady state heterogeneity." Advances in Engineering Software, 2018.

A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions

Y. Gong, H. Yang, C. Dong, "A novel interface integral formulation for 3D steady state thermal conduction problem for a medium with non-homogenous inclusions." Computational Mechanics, 2018.

Service and leadership

Currently signed in to 43 different slack teams

Yanpeng Gong

CV