公颜鹏 Yanpeng Gong

公颜鹏 Yanpeng Gong

Dr., Associate Professor, Department of Mechanics, Beijing University of Technology.

Yanpeng Gong (公颜鹏)

Yanpeng Gong (公颜鹏)

Associate Professor (副研究员)
Department of Mechanics, Faculty of Materials and Manufacturing
Beijing University of Technology, Beijing, China
Ph.D. in Mechanics, Beijing Institute of Technology (2019) · Visiting Ph.D., Durham University, UK (2017–2018, CSC-funded)
Email: yanpeng.gong@bjut.edu.cn | Web: https://yanpeng-gong.github.io

Work Experience

  • 2022–present: Associate Professor (副研究员), Beijing University of Technology
  • 2023–2025: Humboldt Research Fellow, Institute of Photonics, Leibniz University Hannover, Germany
  • 2019–2022: Lecturer, Beijing University of Technology

Research Interests

  • Computational mechanics & numerical methods (isogeometric analysis, BEM, FEM-BEM coupling, virtual element method)
  • Phase-field modeling for electronic packaging reliability & fracture mechanics
  • Machine learning in computational mechanics (physics-informed neural networks, KAN)
  • Smart soft materials & soft robotics mechanics
  • Multiscale & multi-physics simulation
  • Computational software development

Selected Honors & Awards

  • 2025 Du Qing-Hua Outstanding Young Scholar Award in Engineering Computational Methods (杜庆华工程计算方法优秀青年学者奖)
  • 2024 Chaoyang District “Phoenix Program” Distinguished Young Talent (北京市朝阳区”凤凰计划”优秀青年人才)
  • 2022 Alexander von Humboldt Research Fellowship — tenure 2023–2025 (德国洪堡学者)
  • 2019 Outstanding Ph.D. Graduate of Beijing (北京市优秀毕业生)
  • 2017 National Scholarship for Doctoral Students, Ministry of Education of China

Academic Service

  • Editorial Board Member, Scientific Reports (Nature Publishing Group), 2025–present
  • Young Editorial Board Member, Chinese Journal of Applied Mechanics (应用力学学报), 2025–present
  • Young Editorial Board Member, Electronics & Packaging (电子与封装), 2026–present
  • Guest Editor, Scientific Reports Collection “Advanced 3D Packaging and Integration”, 2026 (submission deadline: 11 February 2027)

Research Grants & Projects

As Principal Investigator — Government-Funded Projects:

  1. 2023–2025, Alexander von Humboldt Research Fellowship Programme, Humboldt Foundation
  2. 2021–2023, National Natural Science Foundation of China (Youth Program)
  3. 2021–2023, Beijing Municipal Education Commission Science and Technology Program
  4. 2021, Chaoyang District Postdoctoral Research Fund
  5. 2020–2021, Beijing Postdoctoral Research Foundation (First Class)

As Principal Investigator — Industry Projects:

  1. 2026, Reliability assessment of aircraft landing gear key components
  2. 2025, Oil contamination propagation mechanism in high-pressure hydraulic systems
  3. 2024, Intelligent hydraulic component modeling and simulation based on MWORKS
  4. 2022, Mesoscale simulation of composite solid propellants
  5. 2022, Separation efficiency analysis of cyclone separators

As Co-Investigator:

  1. 2020–2023, Fast direct isogeometric BEM for large-scale coating structures, National Natural Science Foundation of China
  2. 2012–2013, Crack analysis of aeroengine turbine blades using isogeometric BEM, National Natural Science Foundation of China

Selected Publications

Over 60 SCI publications. Representative works:

  1. Y. Gong et al. A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures. Engineering Analysis with Boundary Elements 184, 106640 (2026)
  2. Y. Gong et al. Physics-informed Kolmogorov-Arnold Networks for multi-material elasticity problems in electronic packaging. Applied Mathematical Modelling 156, 116793 (2026)
  3. Y. Gong et al. Virtual element method for thermomechanical analysis of electronic packaging structures with multi-scale features. Engineering with Computers 41, 4799–4824 (2025)
  4. Y. Gong et al. A coupled finite element–boundary element method for transient elastic dynamic analysis of electronic packaging structures. Engineering Structures 326, 119500 (2025)
  5. Y. Gong et al. A phase-field study on thermo-mechanical coupled damage evolution and failure mechanisms of sintered silver interconnections. Engineering Fracture Mechanics 111039 (2025)
  6. Y. Gong et al. An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources. Applied Mathematical Modelling 109, 161–185 (2022)
  7. Y. Gong et al. Hybrid nearly singular integration for three-dimensional isogeometric boundary element analysis of coatings and other thin structures. Computer Methods in Applied Mechanics and Engineering 367, 113099 (2020)
  8. Y. Gong et al. Hybrid nearly singular integration for isogeometric boundary element analysis of coatings and other thin 2D structures. Computer Methods in Applied Mechanics and Engineering 346, 642–673 (2019)

Full list: https://yanpeng-gong.github.io/publications/

Teaching

  • Computational Mechanics (计算力学)
  • Finite Element Method (有限元方法)

Last updated: May 2026